The LPKF ZelFlow RO4 combined hot-air/quartz reflow oven is the ideal tool for rapid SMT prototyping and small batch production. Compact and versatile, the oven has a large working area and microprocessor-controlled temperature/time profiles.
It is capable of SMT Reflow soldering, curing of adhesives and conductive pastes, and other thermal treatments, and its dual access design features both a drawer and a clamshell opening with safety interlocks.
The user can easily program the process temperature and time. All parameters such as preheating/reflow temperatures and times can be saved as user profiles for later use.
The RO4 is also suitable for longer treatments, such as temperature stabilization of electronic components, for up to 24 hours. The start and end of all processes is indicated visually and acoustically. Timers can be set to display count-up or countdown to the end of the process, and the circuit boards are automatically cooled at the end of the process.